Difference between revisions of "NVIDIA Jetson Orin/Introduction/Carrier Boards/Auvidea X230D"

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Forge is Connect Tech’s first full-featured Carrier Board for the NVIDIA® Jetson AGX Orin™ module. This carrier board for Jetson AGX Orin™ is specifically designed for commercially deployable platforms and has a small footprint of 155mm x 125mm.
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Auvidea's X230D is meant to address the need to easily migrate from developments based on the AGX Xavier (X221) to the new AGX Orin by fully supporting integration with NVIDIA's SDK.
  
Forge provides access to an impressive list of latest-generation interfaces on the Jetson AGX Orin while adding additional interfaces of 3x USB 3.2, 2x GbE, Display Port, and a locking 6-pin Mini-Fit Jr. power input connector.
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The X230D delivers industry standard CSI-2 connectors to interface with:
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* RPi-camera modules
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* ArduCam, Vision Components, Framos, Basler, Allied Vision image sensors
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* FPD-Link III
  
Rugged camera add-on expansion boards will also be available for use with Forge to interface directly with high-density MIPI CSI interfaces. Figure 1 shows a picture of the Forge carrier board and Table 1 shows its specifications.
 
  
 
[[File:Connect Tech Rogue Orin.jpg|thumb| center | 600px | Figure 1: Top view of [https://connecttech.com/product/forge-carrier-for-nvidia-jetson-agx-orin/# Forge Carrier for NVIDIA® Jetson AGX Orin™]]]  
 
[[File:Connect Tech Rogue Orin.jpg|thumb| center | 600px | Figure 1: Top view of [https://connecttech.com/product/forge-carrier-for-nvidia-jetson-agx-orin/# Forge Carrier for NVIDIA® Jetson AGX Orin™]]]  

Revision as of 08:27, 1 August 2022



Previous: Introduction/Carrier Boards/Nvidia developer kit Index Next: Introduction/Carrier_Boards/Connect Tech Forge


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Auvidea's X230D is meant to address the need to easily migrate from developments based on the AGX Xavier (X221) to the new AGX Orin by fully supporting integration with NVIDIA's SDK.

The X230D delivers industry standard CSI-2 connectors to interface with:

  • RPi-camera modules
  • ArduCam, Vision Components, Framos, Basler, Allied Vision image sensors
  • FPD-Link III



Table 1: Connect Tech's Forge Carrier Board Specification
Feature Description
Networking
  • 2x 10GBASE-T (10G Ethernet)
  • 2x 1000BASE-T (1G Ethernet)
Camera Inputs 1x DisplayPort
Display
  • 1x 16-Lane MIPI Expansion Connector
  • Interface directly to a range of MIPI CSI, GMSL2 or FPD-Link III image sensors.
USB 1x USB 3.2 Ports (Type-C – OTG Capable), 1x USB 3.2 Ports (Type-C)
Storage 1 x Micro SD/UFS Card Slot, 2x NVMe M.2 Key M Slot
UART
  • 2x @ 3.3V levels UART1 and UART2
  • 2x RS-232/485 UARTs
I2C/SPI
  • 2x I2C Channel @ 3.3V IO
  • 2x SPI Channel @ 3.3V IO
GPIO 4x GPI, 4x GPO
User Expansion
  • 1x M.2 Key E 2230 Wifi/BT (PCIe/USB2)
  • 1x M.2 Key B 3042/3052 (LTE/5G – USB3) with
  • Micro SIM
Input Power +10 to 36V DC Wide Input Power

(6-pin Mini-fit Jr. Connector)

Buttons Power, Reset, Recovery

(Tactile Buttons as well as fine pitch pin header connector)

RTC Battery 3-pin Picoblade connector to accept CTI battery cable assembly
PCB/Electronics Mechanical Information Dimensions: 155mm x 125mm
Operating Temperature -40°C to +85°C (-40°F to +185°F)


You can get this board from the Forge Product Page



Previous: Introduction/Carrier Boards/Nvidia developer kit Index Next: Introduction/Software Support